阿里云盘 超大规模集成电路VLSI设计导论 (2022秋 李镇宜)

file:说明.txt file:18. Supplement.pdf file:17. Design for Skew.pdf file:15. Package, Power, and IO.pdf file:13. CAMs, ROMs, and PLAs.pdf file:12. SRAM.pdf file:11. Datapath Functional Units.pdf file:09. Sequential Circuits.pdf file:08. Circuit Families.pdf file:补充05-HW2 (Layout).mp4 file:补充04-CMOS Design Knowhow & Logic Synthesis.mp4 file:补充03-CMOS Technology & Layout Tool Intro.mp4 file:补充02-Hspice Demo.mp4 file:补充01-Introduction to Hspice Tool.mp4 file:Lec13-Package, Power, and IO (cont.) & Design for Low Power & Design for Skew.mp4 file:Lec12-Design for Testability & Package, Power, and IO.mp4 file:Lec11-SRAM (cont.) & CAMs, ROMs, and PLAs.mp4 file:Lec10-Datapath Functional Units (cont.) & SRAM.mp4 file:Lec09-Sequential Circuits (cont.) & Adders & Datapath Functional Units.mp4 file:Lec08-Circuit Families (cont.) & Sequential Circuits.mp4 file:CMOS VLSI Design: A Circuits and Systems Perspective (4th Edition) - Pearson Addison-Wesley.pdf

NCT***896
阿里云盘
2023-01-10 22:25:23

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